WM Series

1. Product Features

It enables high‑density packaging, integrating seamlessly into ICs and other packages to reduce wiring, thereby achieving low noise and high performance. Thanks to its multilayer structure, it offers a compact footprint and large capacitance. It is ideally suited for current shunting and for optical communication components such as TOSAs and ROSAs. Its high‑frequency characteristics are advantageous, with short current paths between the top and bottom electrodes and low equivalent series inductance (ESL).

2. Product Applications

MLCCs that support wire bonding are primarily used in high-frequency, high-density, and high-reliability electronic packaging applications.

Applicable circuit:

RF bypass and filtering: Used to suppress high-frequency noise and ensure signal purity.

Microwave circuits: Circuits designed for microwave-frequency applications such as radar and satellite communications.

Tuning: Used for frequency tuning in high-frequency oscillator circuits or matching networks.

DC blocking: Allows high-frequency signals to pass while blocking the DC component; commonly used in RF amplifiers and other applications.

Optical modules: Particularly well-suited for optical communication components, such as TOSA (transmitter submodules) and ROSA (receiver submodules), for bypass and coupling applications.

High-speed data links: Used to suppress noise along the signal path, ensuring the integrity of high-speed data transmission.